On October 17th, according to Nanhai Net, Hainan Huaxin Intelligent Manufacturing Semiconductor Co., Ltd., a subsidiary of Shenzhen Huaxinbang Technology Co., Ltd., plans to invest in a silicon carbide project in Haikou Comprehensive Bonded Zone.
The article reveals that Huaxinbang Technology Co., Ltd. has been focusing on the design of mixed signal chips and advanced packaging and testing technology since its establishment in 2008. It is an integrated circuit enterprise rooted in Shenzhen and has a global layout. Currently, it has chip research and development and process centers in Suzhou and Taipei respectively.
Huaxinbang plans to invest 335 million yuan in the Haikou Comprehensive Bonded Zone to build an advanced packaging and testing production base for display module manufacturing and silicon carbide chips. The project will be implemented in stages, with the first phase utilizing approximately 8482 square meters of space in Building 5 of the park to build a pilot line and four AMOLED screen module production lines; According to development needs, the area will be expanded to approximately 17000 square meters to achieve full process mass production of silicon carbide chips and add 4 module production lines, forming a complete industrial chain layout.
Hu Xin, Deputy General Manager of Hainan Huaxin Intelligent Manufacturing Semiconductor Co., Ltd., also stated in an interview with reporters that Huaxinbang will accelerate the registration and site selection work of its subsidiary in Qiong, focusing on the layout of R&D and advanced packaging production lines for overseas markets.

Yuntong Technology: Signed a contract for automotive grade semiconductor projects
On October 11th, according to the official WeChat account of "Nanhai Guicheng", the signing ceremony of Chongqing Yuntong Technology Co., Ltd.'s automotive grade semiconductor project was recently held in Foshan, Guangdong. The project has a total investment of 1 billion yuan and will build Yuntong Technology's South China headquarters, creating a technology research and development base for innovative packaging products of dedicated integrated circuit chips and devices.

Liao Guangchao, Chairman of Chongqing Yuntong Technology Co., Ltd., introduced that Yuntong Technology was established in 2018. It is a semiconductor fablite (light wafer fab) company based on motor drive and power inverter scenarios, with the ability to output application technology solutions, providing automotive grade power semiconductors and ASIC chips, products, modules, and a fully controllable semiconductor chain.
As of now, Yuntong Technology has delivered over 400 million chips, with customers covering international Tier-1 suppliers such as Sanhua Automotive and Denso, and terminal supporting mainstream car companies such as BYD, Changan, SAIC, and GAC. In the future, Yuntong Technology's South China headquarters will focus on the research and mass production of four characteristic packaging series module products and board level solutions in the fields of new energy vehicles, drones, robots, and power system applications.
According to a previous report by "Experts Say Three and a Half Generations", Yuntong Technology is continuing to layout the research and development production of SiC power devices and modules. The deployment of the South China headquarters may further accelerate the application process of SiC products
November 2022: Yuntong Technology announced on its official WeChat account that their module factory has been officially completed and put into use at the Yufu Intelligent Manufacturing Center in Liangjiang New District, Chongqing. The factory plans to invest approximately 100 million yuan and is dedicated to the production, testing, and screening of automotive grade power semiconductor IGBT modules, SiC modules, PIM modules, and other products.
August 2023: Yuntong Technology revealed on its official WeChat account that they are laying out the research and development of third-generation semiconductor power devices represented by SiC (silicon carbide), and have prepared the chip fabrication work for 6-inch silicon carbide chips.
In April 2024, Yuntong Technology announced the launch of a series of SiC MOS with a voltage resistance of 1200V or higher, with an internal resistance of 30m Ω~80m Ω. It is packaged in T0-247 and suitable for automotive thermal management systems, solar inverters, high-voltage DC/DC converters, switching power supplies, and load switches.
Zhongke Guangzhi:
Establish a research and manufacturing center for SiC chip packaging equipment
Recently, Zhongke Guangzhi revealed on their official WeChat account that they have just completed the first signing of Series B financing and received tens of millions of yuan in investment from Chengdu Jinniu District Jiaozi Private Equity Fund Management Co., Ltd. They have also established Zhongke Guangzhi (Chengdu) Technology Co., Ltd., focusing on building a research and manufacturing center for silicon carbide chip packaging equipment, and focusing on the research and industrialization of high-precision fully automatic surface mount machine products.

Zhongke Guangzhi stated that as an important entry point for Zhongke Guangzhi's layout in the southwest market, its Chengdu subsidiary will further serve the company's strategic layout of "based at the headquarters and radiating across the country". By building and forming a collaborative link between the headquarters and subsidiaries, it will fully leverage the advantages of complementary regional resources and strive to achieve a synergistic gain effect of "1+1>2".
According to the official website, Zhongke Guangzhi Company was founded in April 2021, integrating research and development, production, and sales. It focuses on the field of semiconductor packaging equipment and provides cutting-edge packaging process equipment and whole line solutions for the semiconductor, optoelectronic, new display, and advanced manufacturing markets.
According to the "2024 Silicon Carbide (SiC) Industry Research White Paper", Zhongke Guangzhi, with years of accumulated equipment research and development experience, has taken the lead in launching pre mount and nano silver sintering equipment for high reliability SiC chip packaging in China. In 2024, it received orders from customers and has already introduced the equipment into the SiC module production line.
Among them, the main highlights of Zhongke Guangzhi's surface mount machine equipment are fully automatic and high-precision, which can better meet customers' process needs. By optimizing the bond head and replacing imports, it helps customers significantly reduce costs. In terms of silver sintering equipment, Zhongke Guangzhi has also taken the lead in realizing the market launch of single head pressure sintering equipment, and the research and development of fully automatic multi head pressure sintering equipment is also progressing smoothly. It will soon be launched into downstream customers' SiC module production lines.