Vacuum Deposition
2015-11-13 10:22:50

Vacuum deposition is a family of processes used to deposit layers of material atom-by-atom or molecule-by-molecule on a solid surface. These processes operate at pressures well below atmospheric pressure (i.e.vacuum). The deposited layers can range from a thickness of one atom up to millimeters, forming freestanding structures. Multiple layers of different materials can be used, for example to form optical coatings.

When the vapor source is a liquid or solid the process is called physical vapor deposition (PVD). When the source is a chemical vapor precursor the process is called chemical vapor deposition (CVD). The latter has several variants: low-pressure chemical vapor deposition (LPCVD), plasma-enhanced CVD (PECVD), and plasma-assisted CVD (PACVD). Often a combination of PVD and CVD processes are used in the same or connected processing chambers.

PAN based rigid graphite strength board and carbon fiber carbon composite profile, and so on are usually used in this vacuum furnace!

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